Flip-Chip Pressure Sensor Dies from BCM SENSOR

BCM SENSOR has recently released a newly developed flip-chip pressure sensor die for mass production. This flip-chip sensor die, model SE105, is based on piezoresistive working principle and is manufactured by 6” silicon micro-machining process.

Thanks to the unique manufacturing process, the flip-chip is realized at the SE105 pressure sensor die, resulting in the following advantages comparing to the conventional-structure of pressure sensor dies:

• Either corrosive or conductive pressure medium can have direct contact with sensor dies;
• Die bonding and wire bonding are simplified to one bonding process of flip-chip;
• Improved resistance to harsh environment
  

The SE105 flip-chip pressure sensor die features also an outstanding non-linearity of 0.15%fs and an excellent long-term stability of 0.1%fs/year.